【我们会为你提供这样的工作】 

The Non-Volatile Memory group in Shanghai, PRC is looking for a full-time paid intern to support NSG Package Pathfinding and Development team projects including silicon/packaging interaction, assembly process solutions, DOEs execution and coordination with Fab, Intel assembly subcontractors to fulfill assembly process development project objectives, ensuring project schedules and on-time qualification to achieve new product and package transfer to high volume manufacturing. Additional project responsibilities will be added once project begins.   

【我们希望你有以下背景和技能】 

Minimum Qualifications: 

• The candidate must be pursuing a BS or MS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering or related field. 

• The candidate must have the unrestricted right to work in the PRC. without requiring sponsorship.  Preferred Qualifications: 

• 3+ months of experience in electronic materials processing. 

• 3+ months of experience in IC fabrication process. 

• 3+ months of experience in electronic packaging materials and/or assembly process. 

• 3+ months of experience in fast paced environment. 

• At least 3 days/week; 6 months internship is preferred.