RESPONSIBILITY 岗位职责

•The individual will work as intern in VCE team (responsible for assembly process integration) inside packaging engineering group. Leads new product development from concept design to qualification and eventually transfer to mass production.

•Work closely with global functional teams in US, Indian, and Israel, review feasibility design drawings, propose structure design options and launch mechanical sample builds.

•Work closely with both internal teams, tracking product yield and drive for yield improvement.

•Setup new product assembly process flow, manage new product BOM

•Lead new packaging technology transition (new wafer tech/process/material) from engineering stage up to volume production.

•在VCE新产品封装制成整合团队工作，学习并参与新产品开发过程，从概念到量产，获得半导体封装的经验

•与美国和印度的团队紧密合作，审查可行性，提出设计方案，制作工程样品

•追踪产品良率，处理良率异常，协助团队失效分析找到改善方案

•根据产品设计生成新的封装工艺流程，管理产品封装材料清单

•支持先进封装技术的研究和导入

REQUIREMENTS 职位要求：

•Master or PhD Degree students major in Material Science, Polymer Science, Mechanical Engineering, , or other engineering subjects;

•Good English communication and interpersonal skills;

•Self-motivated and self-directed, able to work under high pressure;

•Get approval from Professor; Work at least 3 days per week, longer than 6 months

•硕士或博士生，理工科专业均可

•良好的英语沟通能力和人际交往能力

•自我激励，勤奋，能承受高压力

•实习前得到导师的批准，每周至少三天，大于六个月