欢迎2026年11月至2027年10月毕业的同学加入TI暑期实习项目。面试将于3月23日正式开启。 Responsibilities include, but are not limited to: - Testing and troubleshooting issues - Developing production and characterization test specifications - Creating and managing product documentation - Providing product development support, which involves interfacing with design, test engineering, quality engineering, and other groups - Designing, debugging, and correlating test hardware and software - Designing interface and measurement circuits to make tester capabilities compatible with product definitions Minimum Requirements: - Pursuing an undergraduate or graduate degree in Electrical Engineering, Computer Science, Electrical & Computer Engineering, Mechanical Engineering or related field - Cumulative 3.0/4.0 GPA, or higher Preferred Qualifications: - Strong verbal and written communication skills - Demonstrated strong analytical and problem solving skills - Ability to work in teams and collaborate effectively with people in different functions - Ability to take the initiative and drive for results - Strong time management skills that enable on-time project delivery - Ability to work effectively in a fast-paced and rapidly changing environment - Demonstrated ability to build strong, influential relationships - Coursework providing knowledge and background in semiconductor processing, process control methodology and/or device failure analysis. - Proficiency with bench level test equipment (i.e., DC power supplies, oscilloscopes, multi-meters). - Experience with LabView, Spoffire, MatLab, JAVA, C++, and/or other programming skills